| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| CC2500RGPR | 射频IC |
TI/德州仪器 |
QFN20 |
24+ |
12000 |
|||
| MAX31865AAP+T | IC |
MAXIM/美信 |
SSOP20 |
24+ |
8000 |
|||
| LAN8720AI-CP-TR-ABC | IC |
MICROCHIP/微芯 |
QFN24 |
22+ |
10000 |
|||
| KSZ8863RLLI | IC |
MICROCHIP/微芯 |
LQFP-48 |
23+ |
1250 |
|||
| STM32H723VET6 | IC |
ST/意法 |
LQFP100 |
22+ |
1080 |
|||
| RK3568 | IC |
ROCKCHIP/瑞芯微 |
BGA636 |
22+ |
200 |
|||
| LFE5U-25F-7BG256I | IC |
LATTICE/莱迪斯 |
BGA256 |
23+ |
11900 |
|||
| PIC32MX360F512L-80I/PT | IC |
MICROCHIP/微芯 |
QFP100 |
23+ |
4760 |
|||
| STM8S207RBT6 | IC |
ST/意法 |
LQFP64 |
21+ |
4800 |
|||
| ADS1110A1IDBVR | IC |
TI/德州仪器 |
SOT23-6 |
23+ |
9000 |
|||
| HC32F460JCTA | IC |
HDSC/华大半导体 |
LQFP48 |
21+ |
60000 |
|||
| STM32H750XBH6 | IC |
ST/意法 |
TFBGA-240 |
23+ |
2700 |
|||
| MAX31856MUD+T | 接口IC |
MAXIM/美信 |
TSSOP14 |
23+ |
20000 |
|||
| MAX3221EEAE+T | 接口IC |
MAXIM/美信 |
SSOP16 |
23+ |
10000 |
|||
| STM32G031K6T6 | IC |
ST/意法 |
LQFP32 |
21+ |
6000 |
|||
| ZSC31050FAG1-R | 存储IC |
RENESAS/瑞萨 |
SSOP16 |
23+ |
10000 |
|||
| R7FA6E10F2CFP#AA0 | IC |
RENESAS/瑞萨 |
LQFP100 |
23+ |
1000 |
|||
| STM32H750XBH6 | IC |
ST/意法 |
TFBGA-240 |
22+ |
714 |
|||
| RK860-0 | IC |
ROCKCHIP/瑞芯微 |
QFN |
23+ |
350 |
|||
| RK809-5 | IC |
ROCKCHIP/瑞芯微 |
QFN68 |
23+ |
350 |
商家默认展示20条库存